Ln2 Thermal Shock Vacuum Systems
Standard Specs and Options
- Control temperature setpoints and ramp rates
- Vacuum levels down to 10-7 torr range
- Spare ports and with multiple feedthrough options
- Calibrated vacuum gauges
- Roughing vacuum pump
- Turbo pump with optional gate valve and bypass pumping setup
- Viewport on door
- Vent and purge valves
- Vacuum Cycle Controller with:
- Customizable recipes
- Full integration with valves and gauges
- Automated vacuum and temperature control
- Data logging and remote access
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Optional Features:
Chamber Size
- 14" Cube
- 18" Cube
- 24" Cube
- 36" Cube
- 48" Cube
- Custom Cuboid
Chamber Material
- Aluminum
- Stainless Steel
Thermal Source
Thermal Plate
Thermal Shroud
Vacuum Level
- Rough Vacuum (Ambient to 1 Torr)
- Medium Vacuum (1 Torr to 10E-3 Torr)
- High Vacuum (10E-3 Torr to 10E-7 Torr)
- Ultra High Vacuum (10E-8 Torr and Beyond)
Feedthroughs
- Optical feedthroughs (Viewports)
- Thermocouple Feedthroughs
- Power Feedthroughs
- RF, SMA, and Coaxial Feedthroughs
- Ethernet and USB Feedthroughs
- Rotary Feedthroughs
- Sample Manipulation Feedthroughs (Motion)
Thermal Shock LN2 Systems:
Our Liquid Nitrogen (LN2) Thermal Shock Systems are engineered for demanding qualification and screening programs where component reliability under extreme thermal stress is critical. Designed to meet rigorous military and aerospace standards, our systems support testing in compliance with MIL-STD-883, Method 1010.6 and MIL-STD-202, Method 107G.
Thermal Shock Testing Overview
Thermal shock testing evaluates a product’s resistance to sudden and extreme temperature changes. The process rapidly transfers components between hot and cold environments to simulate in-service thermal conditions, exposing potential failures due to:
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Material expansion/contraction mismatches
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Thermal fatigue
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Solder joint cracking
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Delamination in multi-layer assemblies
Our LN2-based systems offer unmatched temperature transition speed and reliability, essential for defense, aerospace, and high-reliability electronics sectors.
Compliance & Standards
Our systems are fully capable of executing test sequences in accordance with:
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MIL-STD-883, Method 1010.6: Applicable to microelectronic devices, including screening and qualification for thermal fatigue.
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MIL-STD-202, Method 107G: Used for electronic and electrical components, ensuring durability under repeated temperature cycling.
All test profiles are user-configurable with built-in support for cycling durations, dwell times, and transfer rates as specified in the above standards.
System Capabilities
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Temperature Range: -180°C to +200°C
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Cycle Time: Rapid transition times between zones (based on load and configuration)
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Chamber Configurations: Available in a variety of cube and cuboid sizes
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Control System: Advanced PLC-based control with touch interface and programmable profiles
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Data Logging: Integrated system logging with export capabilities (CSV, networked storage, or direct database integration)
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Safety Features: Automatic LN2 flow control, overtemperature protection, and emergency shutoff systems
Typical Applications
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High-reliability electronic component testing
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Aerospace material qualification
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Military and defense hardware screening
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PCB and hybrid assembly validation
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Automotive electronics durability testing
Why LN2-Based Thermal Shock?
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Superior Transition Speeds: LN2 enables rapid chamber cooling to cryogenic levels without mechanical refrigeration delay.
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Precision & Repeatability: Tight thermal control ensures consistent test cycles.
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Operational Efficiency: Minimal moving parts and fast cycling reduce test time and maintenance.
Support & Customization
We offer full engineering support, including custom chamber sizes, fixturing, and test automation integration. All systems are manufactured with long-term serviceability and calibration in mind, supported by a global network of service professionals.
